25 Facts About Multilayer ceramic

1.

The composition of the Multilayer ceramic material defines the electrical behavior and therefore applications.

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2.

Ceramic capacitors, especially multilayer ceramic capacitors, are the most produced and used capacitors in electronic equipment that incorporate approximately one trillion pieces per year.

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3.

In 1926 these Multilayer ceramic capacitors were produced in small quantities with increasing quantities in the 1940s.

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4.

Typical style for Multilayer ceramic capacitors beneath the disc in radio applications at the time after the War from the 1950s through the 1970s was a Multilayer ceramic tube covered with tin or silver on both the inside and outside surface.

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5.

Easy-to-mold Multilayer ceramic material facilitated the development of special and large styles of Multilayer ceramic capacitors for high-voltage, high-frequency and power applications.

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6.

The production of these capacitors using the tape casting and Multilayer ceramic-electrode cofiring processes was a great manufacturing challenge.

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7.

The basic materials of class 1 Multilayer ceramic capacitors are composed of a mixture of finely ground granules of paraelectric materials such as titanium dioxide, modified by additives of zinc, zirconium, niobium, magnesium, tantalum, cobalt and strontium, which are necessary to achieve the capacitor's desired linear characteristics.

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8.

Class 1 Multilayer ceramic capacitors have the lowest volumetric efficiency among Multilayer ceramic capacitors.

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9.

Class 2 Multilayer ceramic capacitors have a dielectric with a high permittivity and therefore a better volumetric efficiency than class 1 capacitors, but lower accuracy and stability.

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10.

The Multilayer ceramic dielectric is characterized by a nonlinear change of capacitance over the temperature range.

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11.

Class 2 Multilayer ceramic capacitors have lower capacitance accuracy and stability, they require higher tolerance.

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12.

Barrier layer Multilayer ceramic capacitors are made of doped ferroelectric materials such as barium titanate .

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13.

Thin Multilayer ceramic foil is cast from a suspension of the powder with a suitable binder.

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14.

Particular problem in the production of multilayer ceramic chip capacitors at the end of the 1990s was a strong price increase of the metals used for the electrodes and terminals.

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15.

Standard multi-layer Multilayer ceramic capacitor has many opposing electrode layers stacked inside connected with two outer terminations.

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16.

The X2Y Multilayer ceramic chip capacitor however is a 4 terminal chip device.

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17.

Capable of replacing 2 or more conventional devices, the X2Y Multilayer ceramic capacitors are ideal for high frequency filtering or noise suppression of supply voltages in digital circuits, and can prove invaluable in meeting stringent EMC demands in dc motors, in automotive, audio, sensor and other applications.

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18.

However, this particular type of Multilayer ceramic capacitor is patented, so these components are still comparatively expensive.

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19.

Power Multilayer ceramic capacitors are mostly specified for much higher than 200 volt-amps.

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20.

Class 1 power Multilayer ceramic capacitors are used for resonant circuit application in transmitter stations.

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21.

Class 2 power Multilayer ceramic capacitors are used for circuit breakers, for power distribution lines, for high voltage power supplies in laser-applications, for induction furnaces and in voltage-doubling circuits.

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22.

Furthermore, in periodic life time tests the voltage proof of Multilayer ceramic capacitors is tested with increased test voltage to ensure safe construction.

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23.

Ohmic losses of Multilayer ceramic capacitors are frequency, temperature and voltage dependent.

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24.

Different Multilayer ceramic materials have differing losses over the temperature range and the operating frequency.

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25.

Multilayer ceramic capacitors are increasingly used to replace tantalum and low capacitance aluminium electrolytic capacitors in applications such as bypass or high frequency switched-mode power supplies as their cost, reliability and size becomes competitive.

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